AI Rack Cooling

The Rear Door Heat Exchanger (RDHx), a liquid-cooling solution specifically engineered for AI high-density computing and future-ready server racks. This system utilizes advanced liquid-to-air heat exchange technology to capture and dissipate thermal energy directly at the rear of the rack where servers expel the most heat. The RDHx is capable of delivering an industry-leading cooling capacity of up to 65kW per rack.

 

Designed for maximum deployment flexibility, the RDHx integrates seamlessly with standard 42U to 60U server racks without requiring alterations to existing data center layouts. The system features an Al-ready intelligent control system that dynamically adjusts fan performance based on real-time thermal response. This efficiency results in a 30% reduction in total energy costs and a 20% reduction in fan power consumption compared to traditional air cooling.

 

Equipped with a 7-inch HMI touchscreen, the system provides real-time monitoring of temperature, pressure, and flow rates. It fully supports modern management protocols, including SNMP, Modbus, WebUI, and Redfish API, ensuring seamless integration into existing infrastructure. Whether for HPC data centers, AI training clusters, or 5G edge sites, the Ablecom RDHx provides a stable and scalable cooling foundation without increasing the physical footprint.

AI Rack Cooling was last modified: December 26th, 2025 by lisa